Description
National Semiconductor Corporation, Published 1988. Wraps, 80 pp.; 28 cm; Vol. II, Summer 1988; illustrated with black-and-white circuit diagrams, schematics, charts, and graphs.
Rare, out-of-print & unusual books · Since 1997
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Condition & notes
In very good condition. Cream and brown paper covers with black and cream lettering on front and spine show mild shelf wear with light bumping and creasing to edges and mild soiling. Binding tight. Pages unmarked. A selection of papers delivered by the technical staff of National Semiconductor at electronics conferences including WESCON '87, ISSCC '88, IEDM '87, and the 1987 Microcontamination Conference and Exposition. Late-1980s Silicon Valley semiconductor engineering, from 16-bit microcontroller cores and bus standards to BiCMOS process technology, cleanroom alternatives, and IC packaging. Complete table of contents printed on front cover. Contents: Sixteen-Bit High-Performance Core Designed For ASIC; A Microcontroller-Based Smart Control Cell; A 33 Mbit/sec Data Synchronizing Phase-Locked-Loop Circuit; The NS32532: High Performance And Software Compatibility; A Comparison Of The Electrical Specifications Of Popular Bus Standards; Three-Dimensional Transient Simulation Of Electro-Thermal Behavior In Semiconductor Devices; Yield Diagnosis Through Interpretation Of Tester Data; Eliminating The Cleanroom: Experiences With An Open-Area SMIF Isolation Site (OASIS); Modeling The AC Impedance Of The Polysilicon-Silicon Interface; Modeling Of Delay And CrossTalk In Interconnects; A VLSI Poly Bipolar Process With 100-ps Gate Delay; An ECL Memory Cell With Separate Read And Write Ports; A High-Performance Bipolar ECL Standard Cell Library For Optimal Design Of High-Speed Bipolar LSI; Poly-Emitter Bipolar Hot-Carrier Effects In An Advanced BiCMOS Technology; A 12-ns 256K BiCMOS SRAM; A New Definition Of Package Thermal Measurement.
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