Description
National Semiconductor Corporation, Published 1989. Wraps, 82 pp.; 28 cm; Vol. IV, Winter 1989; illustrated with black-and-white circuit diagrams, schematics, charts, and photomicrographs.
Rare, out-of-print & unusual books · Since 1997
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Catalog notes
Condition & notes
In very good condition. Cream and slate blue paper covers with black and cream lettering on front and spine show mild shelf wear with light bumping to edges. Binding tight. Pages unmarked. A selection of papers delivered by the technical staff of National Semiconductor at electronics conferences including MIDCON '88, Electro '88, BUSCON/88 EAST, the SAE International Congress, and the Seventh Symposium on Plasma Processing. A snapshot of late-1980s Silicon Valley semiconductor engineering, from ASIC design and embedded C programming to BiCMOS fabrication and surface-mount packaging. Complete table of contents printed on front cover. Contents: ASIC Design Verification Of Microcontroller Cores (J. Hallman); Core-Oriented Microcontrollers Provide The Flexibility And Performance Required In Today's ETR Designs (M. Aghai-Yazdy); C In Embedded Systems And The Microcontroller World (D. LaVerne); Limits Of Backplane Bus Design (P.L. Borrill); Current Developments In Futurebus (D. Hawley); New Switching Regulator's Unique Compensation Scheme Assures Design Simplicity (J. Scolio); A Systems Approach To Smart Sensors And Smart Actuator Design (M. Alby); Development Of A Helium/Chlorine-Based Polysilicon Etch Process For Use At A 1-Micron BiCMOS Gate/Emitter Poly Etch (J. McOmber); Photolithography Expert Systems At National Semiconductor (P. Leitner and R. Brown); Thermocompression Joining Of Copper To Copper For TAB (V. Sajja); Package Cracking And Moisture Absorption In Plastic Surface-Mount Components (A. Switky); Electrical Properties Of Thermally Oxidized Silicon (B. Deal); Testability Using Random Access Test Registers (C. Bui); Design For Test And The Cost Of Quality (C. Salzmann, M. Funcell and R. Taylor).
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